We Offer a Full Range of Printed Circuit Board Capabilities to Fit All of Your PCB Needs

PCBWay is a professional quick turn PCB prototyping,PCB Assembly and low-volume production manufacturer located in Shenzhen China.(3 major PCBs and 2 PCB Assembly production).

The information below details some of the key capabilities that PCBWay can offer and support today. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.

The first category is what we call "Quick-turn" and means we can offer Small Quantity - Quick Turn PCBs, Custom Spec - Quick Turn PCBs.

The second is our “Standard” offering and this shows the very best that PCBWay can offer:Full Spec PCBs, Highly Specialized Precision PCBs, & Large Scale Production,but sometimes some plates and materials are temporarily out of stock.

Please send messages to your sales rep if your boards are beyond the capabilities listed below.

PCB Capabilities - Quick-turn PCB

Manufacturing CapabilitiesRemarks
Number of Layers-1-10 layersFor orders above 10 layers,please view the below "Standard PCB" or contact our sales rep.
For Flex, Rigid-flex, Metal-based (Aluminum etc.,), HDI, Halogen-free, High Tg, etc.,please view the below "Standard PCB" or contact sales rep.
Maximum PCB Size(Dimension)-500*1100mm (min 5*6mm)Any sizes beyond this dimension, please view the below "Standard PCB" or contact sales rep.
Board Size Tolerance(Outline)-±0.2mm/±0.5mm±0.2mm for CNC routing, and ±0.5mm for V-scoring.
Board Thicknessboard thickness0.2-2.4mm0.2,0.4, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0, 2.4mm. Please view the below "Standard PCB" or contact us if your board exceeds these.
Board Thickness Tolerance(t≥1.0mm) -±10%Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface.
Board Thickness Tolerance(t<1.0mm) -±0.1mm
Min TraceMin Trace Min Spacing0.1mm/4milMin manufacturable trace is 4mil(0.1mm), strongly suggest to design trace above 6mil(0.15mm) to save cost.
Min SpacingMin manufacturable spacing is 4mil(0.1mm), strongly suggest to design spacing above 6mil(0.15mm) to save cost.
Outer Layer Copper ThicknessOuter Layer Copper Thickness1oz/2oz/3oz(35μm/70μm/105μm)Also known as copper weight. 35μm=1oz, 70μm=2oz, 105μm=3oz. Please view the below "Standard PCB" or contact us if you need copper weight greater than 3oz.
Inner Layer Copper ThicknessInner Layer Copper Thickness1oz/1.5oz(35μm/50μm)Inner copper weight as per customer’s request for 4 and 6 layers (Multi-layer laminated structure). Please contact us if you need copper weight greater than 1.5oz.
Drill Sizes (CNC)drill Sizes (CNC)0.2-6.3mmMin drill size is 0.2mm, max drill is 6.3mm. Any holes greater than 6.3mm or smaller than 0.3mm will be subject to extra charges.
Min Width of Annular RingMin Width of Annular Ring0.15mm(6mil)For pads with vias in the middle, Min width for Annular Ring is 0.15mm(6mil).
Finished Hole Diameter (CNC)Finished Hole Diameter (CNC)0.2mm-6.2mmThe finished hole diameter will be smaller than size of drill bits because of copper plating in the hole barrels
Finished Hole Size Tolerance(CNC)-±0.08mmFor example, if the drill size is 0.6mm, the finished hole diameter ranges from 0.52mm to 0.68mm will be considered acceptable.
Solder Mask PCB Solder MaskLPILiquid Photo-Imageable is the mostly adopted. Thermosetting Ink is used in the inexpensive paper-based boards.
Minimum Character Width(Legend)PCB Silkscreen0.15mmCharacters of less than 0.15mm wide will be too narrow to be identifiable.
Minimum Character Height (Legend)-0.8mmCharacters of less than 0.8mm high will be too small to be recognizable.
Character Width to Height Ratio (Legend)-1:5In PCB silkscreen legends processing, 1:5 is the most suitable ratio
Minimum Diameter of Plated Half Holes-0.6mmDesign Half-Holes greater than 0.6mm to ensure better connection between boards.
Surface FinishingSurface FinishingHASL with lead
HASL lead free
Immersion gold,OSP
The most popular three types of PCB surface finish. Please view the below "Standard PCB" or contact us for other finishes.
Solder MaskSolder MaskGreen ,Red, Yellow, Blue, White ,Black

No extra charge (Green, Red, Yellow, Blue)

SilkscreenPCB SilkscreenWhite, Black, None

No extra charge.

Tab-routing with Perforation (Stamp Holes)

Leave min clearance of 1.6mm between boards for break-routing. For V-score panelization, set the space between boards to be zero.

Others-Fly Probe Testing (Free) and A.O.I. testing(free), ISO 9001:2008 ,UL Certificate

No extra charge.

Standard PCB Capabilities - Standard PCB

CategoriesNo.ItemsPCB process parametersRemarks
Normal processMedium difficultyHigh difficulty
Non-standard reviewUnable to make
product type1Multilayer PCB Layers3L≤Layers≤16L18L≤Layers≤24L≥24L

2Blind and Buried ViasHDI(1+1+....+N+......+1+1)Anylayer HDIHDI(2+...+N...+2)
If meet the requirements of 2, 6, and 19 at the same time, it is classified as a high requirement product (thickness to diameter ratio, copper thickness of hole)
3Surface CoatingHASL(+gold finger),immersion gold, Immersion Gold +gold fingers with hard gold,OSP (+gold finger with hard gold), Immersion Tin (+gold finger with hard gold) (Not two different surface finish),Immersion TinLocal immersion gold (long or short gold fingers, segmented gold finger craft)Exceed this range require unconventional production processes
Partial immersion gold, thickness of gold or nickel reference to the thickness of the coating
4Board MaterialFR-4;aluminum,Rogers4 series + FR-4 mixed(The Prepreg is ShengYi brand and ROGERS4403 series);CEM-3、LianMao IT158/IT180APure ROGERS4 series multi-layer board (Prepreg is 4450F),PTFE、aluminum+FR4、PTFE+FR4Exceed this range require unconventional production processesPure PTFE multi-layer boardPure PTFE can’t be made because the lamination temperature isn’t up to standard,Can‘t laminate Rogers copper foil directly
Drills5Drill diameterNc drill0.20mm≤Drill diameter≤6.5mm More than 6.0mm using CNC milling
hole diameter 0.2mm: maximum board thickness 1.6mm
hole diameter diameter 0.25mm:maximum board thickness 2.0mm,
hole diameter 0.3mm≤Ф≤0.35mm, maximum board thickness 3.2 mm,
hole diameter 0.4mm≤Ф≤0.55mm, maximum board thickness 4.8 mm,
hole diameter>0.55mm maximum board thickness 6.4 mm
6.5mm or more ±0.1mm ≤ hole diameter tolerance (using CNC milling for 6.5mm or more)The drill diameter more than 6.0mm, the hole diameter tolerance less than ±0.1mm. If exceed this range require unconventional production processes
Drill diameter below 0.2mm, and the aspect ratio≥10, which is medium difficulty
6Thickness to diameter ratioThickness to diameter ratio≤8810Thickness to diameter ratio greater than 12 when the aperture cannot be compensatedIf need to meet the requirement of 2, 6, and 19, it will be treat as high requirement product.
7countersinkhole diameter3.0mm≤hole diameter≤6.5mm
Unconventional production beyond this range
Countersink depth tolerance is controlled 0.15mm
Unconventional production beyond this range
8Hole position tolerances±0.075mm
±0.05mm<+ />-0.05mm
9hole diameter tolerancePTH±0.075mm or no customer requirements±0.05≤ hole diameter tolerance <±0.75mm<±0.05mm<+ />-0.05mmMetallized hole diameter tolerance of 6.0mm or more refers to the requirement of serial number 5
<±0.05mm<+ />-0.025mm
Special holepressfit≤±0.05\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\

non-plated Countersink/Counterbore holes(NPTH)hole diameter <10mm:tolerance ±0.15mm,hole=±0.15mm,hole diameter=diameter ≥10mm:tolerance=≥10mm:tolerance ±=± 0.20mm=0.20mm\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\

non-plated Countersink/Counterbore holes(NPTH)hole diameter <10mm:tolerance ±0.2mm=±0.2mm
hole diameter ≥10mm:tolerance+0.3mm

10Hole to hole spacingcomponent hole≥10MIL8≤Hole to hole spacing≤107≤Hole to hole spacing≤8<7mil

11Slot (Cut-out)Slot widthPlated slot ≥0.5mm
Non-plated slot ≥0.8mm
More than 1.0mm, can be slot by machine
Length to width ratio of slotLength to width≥2Length to width<2

12Castellated HolesCastellated Holes diameter≥0.5mm0.5mm>diameter≥0.4mm\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\

Castellated Holes spacing (edge to edge)≥0.3mm0.3mm>diameters≥0.2mm\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\

13Minimum isolation ring of Inner layer,
The distance between minimum hole in Inner layer and circuit (before compensation)
4L≥7MIL6MIL≤isolation ring, distance<7mil5MIL≤isolation ring, distance<6mil
If the size of one side is greater than 600MM, the inner hole to line and the hole to copper spacing must be greater than or equal to 15mil. If less than 15mil, it must be treated as unconventional review. The conventional process of 10 layers or more need to be incremented by 1 mil for each additional 2 layers. Change the isolation ring to 12mil or more as much as possible

6L≥8MIL6.5MIL≤isolation ring, distance<8mil6MIL≤isolation ring, distance<6.5mil

8L≥9MIL7MIL≤isolation ring, distance<9mil6MIL≤isolation ring, distance<7mil

≥10L≥10MIL8MIL≤isolation ring, distance<10mil<9MIL7MIL≤isolation ring, distance<8mil
image transfer14The min width/spacing of inner layer (before compensation)cooper thickness 18um≥4/4 mil≥4/3.5 mil
<3.5 />3 milwidth/spacing
cooper thickness 35um≥4/5 mil≥4/4 mil
<3.5 />4 milwidth/spacing
cooper thickness 70um≥6/8mil≥6/7mil
<5 />6 milwidth/spacing
cooper thickness 105um≥8/11 mil≥8/10 mil
<6 />9 milwidth/spacing
15The min width/spacing of outer layer (before compensation)cooper thickness 18um≥4/5 mil≥4/4 mil or parts 3.5/3.5mil
<3.5 />3.5 milLocal 3.5/3.5mil, only the distance from the GBA chip area line to the PAD
cooper thickness 35um≥5/6 mil≥5/5 mil
<4 />4 mil
cooper thickness 70um≥7/8mil≥6/7mil
<5 />6 mil
cooper thickness 105um≥10/12 mil≥8/10 mil
<6 />9 mil
16grid trace width/spacingcooper thickness 18um≥7/9 mil≥6/8 mil
<6 />7 mil
cooper thickness 35um≥9/11 mil≥8/10 mil
<8 />9 mil
cooper thickness 70um≥11/13mil≥10/12mil
<10 />11 mil
cooper thickness 105um≥13/15 mil≥12/14 mil
<12 />13 mil
17Minimum weld ring (outer layer)cooper thickness 18umvia hole≥5mil≥4mil<3 mil=mil

component hole≥8mil≥6mil<6 mil=mil

cooper thickness 35umvia hole≥5mil≥4mil<3 mil=mil

component hole≥10mil≥8mil<8 mil=mil

cooper thickness 70umvia hole≥7mil≥6mil<5 mil=mil

component hole≥12mil≥10mil<10 mil=mil

cooper thickness 105umvia hole≥8mil≥6mil<6 mil=mil

component hole≥14mil≥12mil<12 mil=mil

18width tolerance
width tolerance:≥±20%±10%≤ width tolerance:<±20%<±10%
spacing must meet the requirements of 11 and 12, lf width is greater than 15mil, controlled by ±2.5mil
BGA pad diameterhot air leveling (original)≥12MIL≥10MIL
immersion gold (original)diameter≥11mil8.0mil≤diameter<11.0mil
19Line to board edge distanceCNC milling0.25mm0.20mm<0.20mm

SMT width
<7mil,except the=the binding=binding board=board
Metal plating20Plating Thickness(µin)Electroless Nickel-Immersion Gold,ENIGNickel thickness100-150 µin200 µin

gold thickness1-8 µin

>8 µin
Full board gold platingNickel thickness100-150 µin
200-500 µin
Order center check the final price
gold thickness1-10 µin10-50 µin
>50 µin
gold fingerNickel thickness120-150 µin
200-400 µin
gold thickness1-30 µin30-50 µin
>50 µin
21Hole copper thickness (µm)Through hole18-25 µm30-50 µm>50 µm
If 2,6,19 is required to exist at the same time, it will be treated as high requirement. The thickness of the copper is 25-50UM, and the thickness of the copper is required to be 2-3OZ generally.
Blind hole (mechanical hole)18-25 µm30-50 µm>50 µm
Buried hole15-25 µm30-50 µm>50 µm
22Bottom copper thicknessInner and outer copper thickness (OZ)0.5-44-6
solder mask23solder maskgreen solder mask opening(mil)≥2mil1.51
1mil is only concentrated in the BGA area. If the window can be enlarged, increase it as much as possible, but the maximum is 3mil
green solder mask Bridge(mil)cooper thicknesss<2oz4(spacing between ICs is 8 mil, green oil),variegated or black oil≥4.5mil3-4(spacing between ICs is 7-8 mil, green oil),variegated or black oil≥4mil

cooper thicknesss≥2OZ54

Plug Hole diameter0.20mm≤hole diameter≤0.40mm,plug hole fullness 70%0.4mm< hole diameter ≤0.70mmfullness 100%

Plug Hole board thickness0.40mm≤board thickness≤2.4mm>2.4MM

24solder masksolder mask colorGreen, matt green, blue, red, black, matte black, white, yellow\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
Special colors need to be purchased or deployed in advance
silkscreen25Etched silkscreen (finished copper thickness)Copper thickness 18umword width/word height8MIL/40MIL7MIL/35MIL

Copper thickness 35umword width/word height9MIL/40MIL8MIL/35MIL

Copper thickness 75umword width/word height12MIL/60MIL10MIL/50MIL

Copper thickness 105umword width/word height16MIL/60MIL14MIL/50MIL

outline26Maximum board thicknessDouble PCB3.2MM4.5MM>4.5MM
calculated by 4 layers if the thickness more than 3mm
Multilayer layer board3.2MM4.5MM>4.5MM

27Minimum board thickness (single and double panel refers to substrate thickness)Single or Double side PCB (pcb prototype)≥0.3mm0.25mm







28thickness (T) tolerance MM (multilayer layer pcb)T≤1.0±0.10
Need to review if less than the tolerance
If the tolerance is unilateral tolerance, the tolerance shall be double tolerance value, such as: 1.8mm requires positive tolerance, the tolerance shall be 0-0.36mm
1.0<t≤1.6< td="">±0.13
1.6<t≤2.5< td="">±0.18
2.5<t≤3.2< td="">±0.23
29Maximum finished board sizeSingle and double side PCB508×610mmBeyond this range needs to be reviewed

Multilayer Layer PCB508×600mm
30Minimum finished pcb size

31Beveling for gold fingerBevel angle20°30°45°60°

Bevel angle tolerance>±5°±5°<±5°

Bevel depth tolerancetolerance≥±0.15mm±0.15mm< Tolerance ≤ ±0.1mmtolerance<±0.10mm

32Shape tolerance
Tolerance<±0.10mm or=or more=more than=than two=two form=form form=form form=form form=form form=form form=form form=form form=form tolerance=tolerance control=control

The Maximum number of V-CUTIn 20 timesIn 30 timesIn 40 times

Width of the shape80MM< width <560mm60MM< width <80mmwidth <60mm

board thickness0.6MM≦thickness≦2.4MM0.5MM≦thickness<0.6mmthickness<0.5mm or=or thickness=thickness>2.4MM
below 0.5mm is single-sided V-CUT
Remaining thickness≥0.25MM

V-CUTConventional V-CUTT、V-CUT: Skip V-CUT\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\

others34panel sizeThe minimum panel size≥100*120mm\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\<100*120mm
The thickness of the finished board is less than 0.4MM, the panel size can’t exceed 14inch, and the maximum size of the HASL PCB can’t exceed 24inch
the Maximum panel size≤20*24 inch\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\Need to review if beyond range
35impedance controlImpedance control tolerance±10%,50Ω and below:±5Ω\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\<±10%,50ω and=and below=below <±5Ω

bow and twistbow and twist tolerancebow and twist≥0.75%0.75%≤bow and twist≤0.5%bow and twist<0.5%
asymmetry boards bow and twist tolerance 1.2%
36HASL processing capacitycomponent hole diameterhole diameter>0.5mm0.4mm≤hole diameter≤0.5mm

board thickness0.5mm≤board thickness≤3.5mm0.4mm≤board thickness<0.5mm

thickness2um≤thickness of Tin≤30um\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\

37Acceptance CriteriaIPC standardIPC2 level standardIPC Level 3 standard

Upload PCB files( gerber file, .pcb, .pcbdoc or .cam file format)

Thanks for reviewing our PCB capabilities. Please upload your PCB files in the format of gerber file, .pcb, .pcbdoc or .cam file when you go through our online purchase procedures. Please try best to offer gerber file. But if you only have DXP file with (.pcb/.pcbdoc) format, we will use ALtium Designer10.0 software to transfer to gerber.So please avoid higher version than AD10.0 .You can also send your Gerber to your sales rep, but we strongly suggest you order online on the webpages.

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