|Type of production||Rail Transit|
|QFP Pin Spacing (mm):||0.2|
|QFN Pin Spacing(mm):||0.2|
|BGA Ball Spacing(mm):||0.3|
|PCB Layers/Thickness:||8 Layers/0.6mm|
With the introduction of very complex PCB assemblies that have fine pitch QFP’s, micro BGA’s, 01005 components, QFN’s and DFN’s as an example, 3D AOI is no longer a luxury, but essential.
Our 3D AOI system offers the following technological capabilities:-
VT-S series Post Reflow inspection machines have been widely adopted in production lines where high-quality control is required, including the automotive industry. VT-S Series uses a new colour image processing technology called “colour highlight 3D shape reconstruction technology”. The result is the quantification of solder joint shape which dramatically improved accuracy and a reduced number of false rejects. In the field, production needs are evolving with the consolidation of the traceability, and the implementation of quality management on a global basis.
IPC standard class 3 compliance in full real 3D.
Data analysis and quality control software tools.
Repair station functionality with a full 3D display.