|Type of production||Rail Transit|
|QFP Pin Spacing (mm):||0.2|
|QFN Pin Spacing(mm):||0.2|
|BGA Ball Spacing(mm):||0.3|
|PCB Layers/Thickness:||6 Layers/0.8mm|
When it comes to Vias, it’s known to us all that Vias can be divided into Through-hole Vias, Blind Vias and Buried Vias. They have different functions.
With the development of electronic products, vias play a vital role in the interconnection between layers in a printed circuit board. The application of Via-in-Pad is widely used in small-scale PCBs and BGA((ball grid arrays). As the necessary development of high-density, BGA (Ball Grid Array) and SMD chip miniaturization, the use of Via-in-Pad technology have become increasingly significant.
Compared with bind hole and buried hole, Via-in-Pad technology has a lot of advantages:
．Suitable for precision pitch BGA.
．Lead to higher density PCBs and promote space savings.
．Better thermal management for heat dissipation.
．Resists high-speed design such as low inductance.
．share a flat surface with component accessories.
．Reduce the PCB area and further improve wiring.
Due to these advantages, via-in-pads are widely used in small PCBs, especially PCBs that require a limited BGA space and are focused on heat transfer and high-speed design. Although blind holes and buried holes help increase density and save space on the PCB, through-hole pads are still the best choice for thermal management and high-speed design elements. Taking into account costs, different projects can lead to different costs. Therefore, if your project involves vias and you have no idea of choosing which type, please contact our engineers for the best solution.
With the reliable Via filling/capping process, Via-in-Pad technology can be used to produce high-density PCB without the use of chemical enclosures and avoiding soldering errors. Besides, this can provide the BGA with additional conductor traces.
We use this technology for many years now and get the ability of ensuring a reliable and safe production process.